Good day, I am reaching out this mail because my client just released 2 ASM AD 830 in working condition recently, they want to sell them by this week because their project ends,
They have dropped the price from 70K to only 55K EXW because they want to write them out off the books by April.
The vintage is 2009, complete and still in working condition, please see below for detailed configuration and photos, there are several clients in China interested as well, please let me know how you would like to proceed, thank you very much.
(Qty: 2)
ASM AD 830 Die bonders, 6"
Accuracy: ±38um
Rotation: ±3°
Cycle Time: 0.25 Sec
Inspection: Pre/Post capable
Die Size: 150 x 150 ~ 1500 x 1500 mm
Capable of rotary bond head
Lead frame size:
Length: 110 ~ 260 mm
Width: 12.7 ~ 75 mm
Thickness: 0.12 ~ 0.762 mm
Magazine size:
Length: 150 ~ 260 mm
Width: 15.7 ~ 75 mm
Height: 68 ~ 190 mm
Bond head:
Bond/Pick force: 30 ~ 200g
X-Resolution: 0,2um
Y-Resolution: 0.5um
Stack loader:
Wafer loader
Track
PR System
Wafer table
Auto change
Width: 12.7 ~ 75mm
Resolution: 512 x 512
2009 vintage.
Comments