My End User supplier is releasing 3 units SHINKAWA UTC-1000 Wire Bonder in working condition for sale.
Please review the full spec and photos, and let me know if you are interested.
SHINKAWA UTC-1000 Wire bonder
Bonding method: Ultrasonic thermocompression
Machine accuracy: ±2.5 µm (3σ)
Bonding speed: 67 ms / 2 mm wire
Bonding wire length: 8 mm (Maximum)
Wire diameter: Gold wire φ15 µm - φ38 µm
Number of bonding wires: (8000) Wires
Loader / Unloader: Magazine stacker type
Indexer: Center-parting type universal indexer
Compressed air: 500 kPa
Vacuum pressure: 74 kPa
Pattern recognition unit:
Detection method: Gray scale correlation
Detection speed: 0.11 s / 2-point allignment
Detection area:
Lead side (X: ±1.26 mm, Y: ±0.86 mm)
Die side (X: ±0.31 mm, Y: ±0.21 mm)
Bonding area:
X: ±28 mm
Y: ±33 mm
Power supply: 100 VAC±5 %, 50 / 60 Hz
Power consumption: 1000 W
2006 vintage.
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