My user client is planning on removing a EVG / EV GROUP 520 Wafer Bonder due to new production priorities and will be making this avaialble for immediate release.
They are asking $85,000 for this system with everything included in the description below.
Please review the specs and photos and let me know if you have any questions.
EVG / EV GROUP 520 Wafer bonder
Manual wafer load substrate bonder
High-vacuum capable bond chamber
Auto opening of bond tool cover
Fusion compression bonding
Thermal compression bonding
Anodic bonding
Chucks: 4"-6"
Max bond force: 7 kN
Top side heater: 550°C maximum in 1°C step
Bottom side heater: 550°C maximum in 1°C step
Merlin M75 Chiller
Temp uniformity: +/- 1.5%
Turbo pump and controller
Roughing pump
Cool station
Load / unload tool
Computer, monitor and keyboard
Operations manual included.
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