is looking to purchase a DATACON / BESI 2200 Evo Plus system.
Our client has an approved budget for a system with max 8" wafer capability with multi wafer exchanger.
Ideal configurations would include 50-1200 mils die size, 120um min die thickness and baseplate in 100mm pallet.
We can have an offer presented upon review of the condition of a working system.
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