Good day. Hope everything is going well.
I'm reaching out to see if you have any interest on our newly available EVG / EV GROUP 501 bonder since we discussed similar models in the past. This is a fully optioned 200mm bonder which one can use chucks for smaller wafers in it in case the application is 150mm or smaller. It has the maximum option for up to 10kN force. This system is still installed and working perfectly in our client's place. Our client completed the project and is looking to sell this unit. He is welcoming all reasonable offers so if you are interested, please let me know. FYI, the chucks are not included. Thank you.
EVG / EV GROUP 501 Bonder
Maximum contact force: 10 kN
Vacuum: 0.1 mbar
Does not include bond chucks.
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